trinamiX PbS infrared sensor single TO package
The PbS chip utilizing trinamiX's thin-film sealing technology can achieve double sealing through the TO package.
The dual sealing technology using thin films and TO packages achieves long lifespan and optimal detectability at room temperature. It is a TO package type that enhances safety, robustness, and compatibility with existing products.
- Company：アイ・アール・システム
- Price：Other
